Difference between revisions of "Mainpage"
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|style="width: 25%; text-align: left; padding-left: 1%; padding-right: 1%; vertical-align: top"| | |style="width: 25%; text-align: left; padding-left: 1%; padding-right: 1%; vertical-align: top"| | ||
{{Box|title=Chip Packaging|content=Low-cost, HF compliant, small size and more.</br> | {{Box|title=Chip Packaging|content=Low-cost, HF compliant, small size and more.</br> | ||
− | • [[Bare Die Bonded to PCB]]</br> • [[Flip Chip]]</br> • [[QFN]]</br> • [[FAM | + | • [[Bare Die Bonded to PCB]]</br> • [[Flip Chip]]</br> • [[(FAM) QFN]]</br> • [[(FAM) LGA]]</br> • [[Silicon Package]]</br> • [[Chip Embedding]] |
}} | }} | ||
|style="width: 25%; text-align: left; padding-left: 1%; padding-right: 1%; vertical-align: top"| | |style="width: 25%; text-align: left; padding-left: 1%; padding-right: 1%; vertical-align: top"| |
Revision as of 09:40, 26 August 2019