Bare Die Bonded to PCB

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It is the simplest method to evaluate the MMICs as well as sample productions for small quantities. Chip is glued directly on the printed circuit board (PCB) with or without using a cavity. Then, gold or aluminium wire bonds are used to make the electrical connections from pads of the chip to the lines on the PCB. Optionally, a glop-top procedure can be applied to protect the chip and the wire bonds from damage.


Advantages:

  • Can be custom to each MMIC allowing a very short bond wires for RF pads
  • Wafer probe testing of MMIC is possible


Disadvantages:

  • Full chip functionality cannot be tested, since the MMIC is not in a package that is suitable for an industrial socket
  • MMIC is not replaceable on the PCB
  • Not suitable for series production