Chip embedding with µ² technique is an advanced PCB-based technology. Rather than a standard printed circuit boards (PCB) technology with 50-100 um line and space, this technology allows down to 20 um line and space with very good tolerance. Accordingly, fine-tuned antenna structures can be designed. In addition to that, MMIC is buried into the PCB. Pads are connected to lines using copper pillars or gold stud bumps.
- Good RF performance
- No need for bond wires or Film Assisted Molding (FAM)
- Low cost and fast processing if the series production is started
- Suitable for multi-chip modules with high-accuracy antennas on board
- Suitable for QFN footprint
- Very expensive and long lead times for prototyping
- Harder to solder on a PCB compared to lead-frame based packages