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Hanno Ritzerfeld
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Hanno Ritzerfeld2021-09-22 23:51:142021-09-22 23:54:19Visit us at the sps 2021
EVALUATION KITS
Evaluation plattform with radar front ends
support fast implementation of test measurements
ASIC DESIGN
Up to 300 GHz ASICs using low-cost
SiGe technology even for small amounts.
PRODUCTS
Find radar front ends and related products for 24 GHz, 60 GHz and 120 GHz ISM Band.
ASIC Design
The economical solution even for small batches – Application Specific Integrated Circuits featuring frequencies up to 300 GHz.
APPLICATIONS
The better solution – radar sensors find their application in many areas formerly reserved for lasers measurement and ultrasound.
Silicon Radar designs and delivers Monolithic Microwave Integrated Circuit (MMICs) on a technologically advanced level. Amongst others they are manufactured in affordable Silicon-Germanium-Technology (SiGe). Our products support a wide range of applications like precision measurement, material analysis, object control, object detection, medical monitoring and automotive applications.
WHAT WE OFFER
We offer high frequency circuits for radar solutions, phased-array-systems and wireless communications as series products. Silicon Radar is your reliable partner for the supply of standard circuits in frequency range from 24 GHz up to 120 GHz. >> More about us
ASIC design of MMICs up to 300 GHz and with high bandwidth are part of our service portfolio. Specialized on SiGe technology we can offer competitive prices even for small amounts. Long term experience and a certified supply chain guarantee for a quick project flow. >> More about ASIC Design
YOUR ADVANTAGE
Our skilled team, predesigned and tested circuit building block as well as in depth knowledge of SiGe technology result in cutting edge products both in series production and ASIC design.
But we carry the idea further – we design complete radar sensors to your specifications – including data evaluation. >> More about Sensor Design
MEET US – UPCOMING EVENTS
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Hanno Ritzerfeld
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Hanno Ritzerfeld2021-09-22 23:51:142021-09-22 23:54:19Visit us at the sps 2021Package Design for High Frequencies
Molding compound and package design influence the performance of a MMIC at high frequencies. Thus packaging the silicon chips has to be addressed in an early stage of development .
Special Solutions for Special Demands
We have a wide network of suppliers developing new packaging technologies with us. Windows opening the package for antennas or even antennas on a package are feasible.
Bare Die or Package
At Silicon Radar we offer many of our products either as bare die so you can design your own package or in packages like standard QFN or custom developments.