(FAM) QFN

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1 Quad-flat no-lead (QFN)

Quad-flat no-lead (QFN) is one of the standard packaging technologies used in electronics. MMIC is wire bonded to a pre-produced lead frame. Then, whole package is molded on top with plastic. Having 0.4mm to 0.6mm pitch, it is easy to handle for surface mount technologies (SMT) for assembly printed circuit boards (PCB). For more detailed information: Wikipedia - QFN

TRX 06 frei.png


Advantages:

  • Cheap and Reliable
  • Suitable for series production and series testing


Disadvantages:

  • Short RF bond wires are not possible
  • RF signal loss due to long bond wires for RF pads
  • RF signal loss over the molding material for on chip antenna versions


Since this technology is very well known and widely used around the globe, Silicon Radar is trying to keep its standard layouts even for other packaging technologies.

2 Film Assisted Molded (FAM) QFN

Film Assisted Molded QFN is one the series production technologies that; Silicon Radar has been using for antennas in package solutions. Antennas are manufactured on an RF material and placed next to the MMIC in the lead frame. Then RF pads are directly wire bonded to the antennas. To overcome the RF losses in the molding material as in a standard QFN package, RF wire bonds are kept short and a window is opened over the antennas using a film assisted molding technology.

TRX_120_001
TRX_120_001

Advantages:

  • Reliable
  • Short RF bond wires possible
  • Suitable for QFN footprint
  • Suitable for series production and series testing


Disadvantages:

  • Requirement for fine antenna and MMIC placement
  • Requirement for careful wire bonding
  • Slower in series production making it more expensive in very high quantities
  • More expensive than a standard QFN