(FAM) LGA

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1 Land Grid Array (LGA)

Land Grid Array (LGA) is another standard technology for packaging MMICs. Instead of using a lead-frame as used in a QFN, a printed circuit board (PCB) is used as a base for the package. Chip is placed and wire bonded on the PCB base and molded on the top. Compared to QFN, LGA allows shorter bond wires and custom antenna designs on the package, because the base PCB can be designed accordingly.

TRX 060 011.png

Advantages:

  • Reliable, low cost and fast processing
  • Short RF bond wires possible
  • Suitable for QFN footprint


Disadvantages:

  • Not the best RF performance
  • Harder to solder on a PCB compared to lead-frame based packages

2 Film Assisted Molded (FAM) LGA

LGA is almost in the same method as Quad-flat no-lead (QFN) by only replacing the lead frame with a custom designed printed circuit board (PCB). Therefore, Film Assisted Molding (FAM) technology can also be used. This allows opening a window on top of the antennas to reduce the RF losses.

TRX 120 027 packaging.png

Advantages:

  • Reliable and Low cost
  • No need for fine placement of the antennas next to MMIC as in FAM QFN
  • Short RF bond wires possible
  • Suitable for QFN footprint


Disadvantages:

  • Requirement for careful wire bonding
  • Not the best RF performance