Difference between revisions of "Chip Embedding"
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(Created page with "Chip embedding with µ² technique is an advanced PCB-based technology. Rather than a standard printed circuit boards (PCB) technology with 50-100 um line and space, this tech...") |
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Chip embedding with µ² technique is an advanced PCB-based technology. Rather than a standard printed circuit boards (PCB) technology with 50-100 um line and space, this technology allows down to 20 um line and space with very good tolerance. Accordingly, fine-tuned antenna structures can be designed. In addition to that, MMIC is buried into the PCB. Pads are connected to lines using copper pillars or gold stud bumps. | Chip embedding with µ² technique is an advanced PCB-based technology. Rather than a standard printed circuit boards (PCB) technology with 50-100 um line and space, this technology allows down to 20 um line and space with very good tolerance. Accordingly, fine-tuned antenna structures can be designed. In addition to that, MMIC is buried into the PCB. Pads are connected to lines using copper pillars or gold stud bumps. | ||
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Advantages: | Advantages: | ||
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*Suitable for multi-chip modules with high-accuracy antennas on board | *Suitable for multi-chip modules with high-accuracy antennas on board | ||
*Suitable for QFN footprint | *Suitable for QFN footprint | ||
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Disadvantages: | Disadvantages: | ||
*Very expensive and long lead times for prototyping | *Very expensive and long lead times for prototyping | ||
*Harder to solder on a PCB compared to lead-frame based packages | *Harder to solder on a PCB compared to lead-frame based packages | ||
Latest revision as of 09:51, 26 August 2019
Chip embedding with µ² technique is an advanced PCB-based technology. Rather than a standard printed circuit boards (PCB) technology with 50-100 um line and space, this technology allows down to 20 um line and space with very good tolerance. Accordingly, fine-tuned antenna structures can be designed. In addition to that, MMIC is buried into the PCB. Pads are connected to lines using copper pillars or gold stud bumps.
Advantages:
- Good RF performance
- No need for bond wires or Film Assisted Molding (FAM)
- Low cost and fast processing if the series production is started
- Suitable for multi-chip modules with high-accuracy antennas on board
- Suitable for QFN footprint
Disadvantages:
- Very expensive and long lead times for prototyping
- Harder to solder on a PCB compared to lead-frame based packages
