FAM LGA

Land Grid Array (LGA) is almost in the same method as Quad-flat no-lead (QFN) by only replacing the lead frame with a custom designed printed circuit board (PCB). Therefore, Film Assisted Molding (FAM) technology can also be used. This allows opening a window on top of the antennas to reduce the RF losses.

Advantages:

Reliable and Low cost

No need for fine placement of the antennas next to MMIC as in FAM QFN

Short RF bond wires possible

Suitable for QFN footprint

Disadvantages:

Requirement for careful wire bonding

Not the best RF performance