Flip Chip

Flip chip is another method to evaluate the MMICs, as well as sample productions for small quantities. Solder bumps or stud bumps are placed on the pads of the MMIC. Then, MMIC is directly placed on the printed circuit boards (PCB), and soldered. This allows very short connection from pads of the chip to PCB; however pitch between pads must be kept 300-400um wide to fit the standard PCB technology requirements. This makes the MMIC bigger for complex designs.

Advantages:

Low cost

No requirement for bond wires

Good RF performance

Suitable for series production and series testing

Disadvantages:

Requirement for high pitch between pads making the MMIC bigger

Not suitable for standard footprints such as QFN

Harder to make series tests

More expensive than a standard QFN