Difference between revisions of "Flip Chip"
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| − | Flip chip is another method to evaluate the MMICs as well as sample productions for small quantities. Solder bumps or stud bumps are placed on the pads of the MMIC. Then, MMIC is directly placed on the printed circuit boards (PCB), and soldered. This allows very short connection from pads of the chip to PCB; however pitch between pads must be kept 300-400um wide to fit the standard PCB technology requirements. This makes the MMIC bigger for complex designs. | + | Flip chip is another method to evaluate the MMICs, as well as sample productions for small quantities. Solder bumps or stud bumps are placed on the pads of the MMIC. Then, MMIC is directly placed on the printed circuit boards (PCB), and soldered. This allows very short connection from pads of the chip to PCB; however pitch between pads must be kept 300-400um wide to fit the standard PCB technology requirements. This makes the MMIC bigger for complex designs. |
Revision as of 14:21, 22 August 2019
Flip chip is another method to evaluate the MMICs, as well as sample productions for small quantities. Solder bumps or stud bumps are placed on the pads of the MMIC. Then, MMIC is directly placed on the printed circuit boards (PCB), and soldered. This allows very short connection from pads of the chip to PCB; however pitch between pads must be kept 300-400um wide to fit the standard PCB technology requirements. This makes the MMIC bigger for complex designs.
Advantages:
Low cost
No requirement for bond wires
Good RF performance
Suitable for series production and series testing
Disadvantages:
Requirement for high pitch between pads making the MMIC bigger
Not suitable for standard footprints such as QFN
Harder to make series tests
More expensive than a standard QFN
