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ISM-Band
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Status of IC
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Packaging Solution
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Series End-of-Line Test
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Antenna Solution
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Evaluation / Sensor
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- Pre-production status
- Samples available (out of third IC generation)
- TRL 5
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- Options under investigation:
- LGA-based molded QFN style package
- Chip-embedding PCB (automotive grade technology)
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- Printed antenna on PCB
- Reference patch antenna designs available
- Monostatic version (coupler on chip); one antenna for Tx and Rx
- Optimal focal point under lens
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- Available
- 2nd generation of EvalKit in order to shrink production cost under way
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- Pre-production status
- Samples available (out of third IC generation)
- TRL 5
|
- Options under investigation:
- LGA-based molded QFN style package
- Chip-embedding PCB (automotive grade technology)
|
|
- Printed antenna on PCB
- Reference patch antenna designs available
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- In progress
- 1st generation of MIMO EvalKit (under development)
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