Changes

Jump to navigation Jump to search

Mainpage

2 bytes added, 11:35, 23 August 2019
no edit summary
|style="width: 25%; text-align: left; padding-left: 1%; padding-right: 1%; vertical-align: top"|
{{Box|title=Chip Packaging|content=Low-cost, HF compliant, small size and more.</br>
&bull;&nbsp;[[Bare Die Bonded to PCB]]</br> &bull;&nbsp;[[Flip Chip]]</br> &bull;&nbsp;[[QFN]]</br> &bull;&nbsp;[[FAM QFN]]</br> &bull;&nbsp;[[LGA]]</br> &bull;&nbsp;[[(FAM ) LGA]]
}}
|style="width: 25%; text-align: left; padding-left: 1%; padding-right: 1%; vertical-align: top"|
90
edits

Navigation menu