Material Analysis

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Revision as of 15:06, 19 August 2019 by Jane (talk | contribs) (Jane moved page Material Detection and Analysis to Material Analysis without leaving a redirect)
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1 Thickness Measurement

Characteristics of mmW-Radar IC Frequency Front End Package
  • Small IC dimensions / low price per unit
  • Wide selection of frequency bands
  • At frequencies beyond 100GHz with OnChip-antennas
  • Comparable simple sensor architecture

10 GHz up to 300 GHz

24 GHz
60 GHz
120 GHz / 300 GHz

QFN
LGA / FAM / Flip Chip in PCB embedded
OnChip antenna in QFN; Flip Chip in PCB embedded; Si Package with Si lens

2 Non-Destructive Testing

Characteristics of mmW-Radar IC Frequency Front End Package
  • Small IC dimensions / low price per unit
  • Wide selection of frequency bands
  • At frequencies beyond 100GHz with OnChip-antennas
  • Comparable simple sensor architecture

10 GHz up to 300 GHz

24 GHz
60 GHz
120 GHz / 300 GHz

QFN
LGA / FAM / Flip Chip in PCB embedded
OnChip antenna in QFN; Flip Chip in PCB embedded; Si Package with Si lens

3 High Resolution / high precision positioning

Characteristics of mmW-Radar IC Frequency Front End Package
  • Small IC dimensions / low price per unit
  • Wide selection of frequency bands
  • At frequencies beyond 100GHz with OnChip-antennas
  • Comparable simple sensor architecture

60 GHz up to 300 GHz

60 GHz
120 GHz / 300 GHz

QFN
LGA / FAM / Flip Chip in PCB embedded
OnChip antenna in QFN; Flip Chip in PCB embedded; Si Package with Si lens