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25 bytes added, 09:40, 26 August 2019
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{{Box|title=Chip Packaging|content=Low-cost, HF compliant, small size and more.</br>
&bull;&nbsp;[[Bare Die Bonded to PCB]]</br> &bull;&nbsp;[[Flip Chip]]</br> &bull;&nbsp;[[(FAM) QFN]]</br> &bull;&nbsp;[[(FAM QFN) LGA]]</br> &bull;&nbsp;[[LGASilicon Package]]</br> &bull;&nbsp;[[(FAM) LGAChip Embedding]]
}}
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