LGA

Land Grid Array (LGA) is another standard technology for packaging MMICs. Instead of using a lead-frame as used in a QFN, a printed circuit board (PCB) is used as a base for the package. Chip is placed and wire bonded on the PCB base and molded on the top. Compared to QFN, LGA allows shorter bond wires and custom antenna designs on the package, because the base PCB can be designed accordingly.

Advantages:

Reliable, low cost and fast processing

Short RF bond wires possible

Suitable for QFN footprint

Disadvantages:

Not the best RF performance

Harder to solder on a PCB compared to lead-frame based packages